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Packaging cap and its preparation method and package sealed with cap
Patent name Packaging caps and methods for their preparation and packages sealed with caps Patent applicant Stano Aesop O. Co., Ltd. Principal applicant Address Helsinki, Finland Inventor Tappan Pentinen; Risto Salmi Ning Application (Patent) No. 02820461.1 Date of Application 2002.10.15 Certification Date Approval Notice No. 1571728 Date of Validation Notice 2005.01.26 Specification CD No. D0504 Main Classification No. B32B27/10 Classification No. B32B27/10; B65D77/20 Division Original Application No. First The present invention relates to a cap (1) which can be heat sealed to the opening of a package (2) and peeled off when the package is opened. In addition, the present invention includes a method of preparing such a cap and a package sealed with a cap, and also relates to a sealed package equipped with a cap. The cover (1) consists of a fibrous material layer (6) which may be paper or cardboard, a suitable material being an oxygen barrier layer (7) of PET, EVOH or PA and a heat seal layer (8). According to the invention, the heat seal layer (8) comprises EMA, EVA and polyamide wax, allowing the heat seal layer to adhere directly to the oxygen barrier layer without any intermediate adhesive layer. During the preparation of the lid, the oxygen barrier layer and the heat seal layer can be applied to the paper or paperboard by co-extrusion. The package equipped with a lid according to the present invention includes, for example, a box, a cup, or a wine glass in which a food such as a beverage, nutritive fat or a ready-to-use food is packaged. Sovereign Item 1. Cover (1), which can be heat sealed to the opening of the package (2) and peeled off when the package is opened, which contains a layer of fiber material (6), a polymer oxygen barrier layer (7) and a polymer The heat seal layer (8) is characterized in that the heat seal layer (8) comprises an ethylene methyl acrylate copolymer (EMA), an ethylene vinyl acetate copolymer (EVA) and a polyamide wax, and The sealing layer adheres directly to the higher oxygen barrier layer (7) without any intermediate binder.