Medium melting point polyamide hot melt adhesive formula

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Component Amount / mol Component Amount / mol
Polyunsaturated fatty acids 0.8 Ethylenediamine 0.9
Sebacic acid 0.1 Has diamine 0.1


Preparation and Curing The product is prepared by polymerizing the formulation. Heat to 160-170°C, bond after hot melt.

Use The softening point of the rubber is 150°C, mainly used for bonding of packaging, leather and paper products.



Source: 21st Century Fine Network

Armrest Dining Chair

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