Japan OKI Industry Co., Ltd. has developed a thin-film bonding technology that is very useful for the development of high-performance semiconductors and displays. This is a technique that thins out materials and allows molecules of different kinds of materials to bind to each other. The company has used this technology for mass production of light sources for printer exposure, which combines light emitting diodes (LEDs) directly with the driver IC chip. Using this array of high-density integrated light-emitting diodes (LEDs) produces high-precision displays and semiconductors that require no wiring and high-frequency characteristics. As a core technology, the company invests billions of yen each year in applied research.

The thin-film bonding technology developed by the company is called a dual-film bonding technology, which is a technical method of peeling a thin film formed on a base plate to allow it to be combined on different materials. Unique technologies are also used in the method of integration. This time, the light-emitting layer was peeled off from the compound semiconductor and allowed to bond with the silicon IC chip. Such a light emitting diode (LED) integrated with a driver IC chip is used for mass production of a light emitting diode (LED) head for a light source for printer exposure. There is no wiring between the IC chip and the light emitting diode (LED), and the volume is reduced by half compared to the conventional light emitting diode (LED) head.

Using this technology, displays are also produced in which light-emitting diode (LED) planes integrated with IC chips are arranged on a glass bottom plate. The company has a technology that arranges 1200 light-emitting diodes (LEDs) within one inch of the printer's exposure head technology, and can theoretically produce type 2 high-definition (HD) displays. In addition, if applied to IC integrated circuits, it is also possible to exceed the limits of traditional semiconductor performance, produce high-frequency, high-sensitivity, high-integration semiconductors, and hope to develop new sensing devices.

Oki Electric Co., Ltd. puts this technology in the company's core technology and establishes a research and development organization. In addition, in the final stage of productization, cooperation with other companies will also be considered as needed.

Source: OKI